In a strategic partnership, Rittal and ZutaCore, an expert in waterless two-phase liquid cooling, have developed the first Rittal High Density Cooled-by-ZutaCore solutions. With this cooperation, Rittal is expanding its comprehensive range of IT solutions with innovative direct chip cooling for high power densities and hotspot situations.
Customers will be able to obtain highly efficient, scalable cooling solutions for demanding cooling requirements – from edge, hyperscale and colocation through to high-performance computing (HPC) – from a single source.
Best conditions for High Performance Computing
By using an innovative direct-on-chip evaporative cooling technology, Rittal racks are prepared to cool any existing or future processor that might be required, regardless of its power consumption. This avoids hotspots at server level and meets the requirements placed on high-performance computers.
Your benefits at a glance:
- A powerful cooling solution that goes beyond the limits of air-based cooling
- Minimising the risk of IT failure using NovecTM 7000, a non-conductive coolant
- A two-phase liquid cooling system designed to cool future generations of processors in the range of 1000 W and more
We are there for you.
You have questions? Then write to us at firstname.lastname@example.org. We will be happy to answer all your questions about Rittal High Density Cooled-by-ZutaCore.