Artificial intelligence and high-performance computing (HPC) pose new challenges for data centres. Increasing computing power and high-power densities resulting from AI workloads, GPUs and processors generate massive heat loads of over 150 kW per rack. These can no longer be efficiently managed with conventional air cooling alone. At the same time, demands for energy efficiency, availability and scalability of systems are growing across all industries, applications and data centre sizes. New cooling concepts are therefore no longer an option, but a must.
Direct Liquid Cooling opens up new possibilities for cooling AI and HPC infrastructures. By efficiently dissipating heat via liquid, maximum cooling performance is delivered exactly where it is needed.
This technology lays the foundation for modern AI environments – from individual racks to scalable data centre designs.