Direct Liquid Cooling

Powerful and modular solution portfolio for AI and HPC applications

AI cooling

Direct Liquid Cooling

Artificial intelligence and high-performance computing (HPC) pose new challenges for data centers. Increasing computing power and high-power densities resulting from AI workloads, GPUs and processors generate massive heat loads of over 150 kW per rack. These can no longer be efficiently managed with conventional air cooling alone. At the same time, demands for energy efficiency, availability and scalability of systems are growing across all industries, applications and data center sizes. New cooling concepts are therefore no longer an option, but a must.

Direct Liquid Cooling opens up new possibilities for cooling AI and HPC infrastructures. By efficiently dissipating heat via liquid, maximum cooling performance is delivered exactly where it is needed.
This technology lays the foundation for modern AI environments – from individual racks to scalable data center designs.
 

Rittal Product Portfolio for Direct Liquid Cooling

CDU In-Row

Liquid-to-liquid Coolant Distribution Unit In-Row 

  • Enormous performance in a small footprint, OCP-compliant: Up to 1.5 MW and 1,500 l/min in the OCP Open Rack v3
  • Flexible scaling: Modular design for on-demand expansion – “pay as you grow”
  • Maximum availability: Redundant components and defined fallback scenarios ensure continuous operation
  • Easy maintenance during operation: Hot-swappable components, such as pumps, filters, sensors, and controllers, reduce downtime
  • Seamless integration into monitoring systems thanks to a wide range of network protocols

CDU In-Rack

Liquid-to-liquid Coolant Distribution Unit In-Rack 21"

  • High performance: Up to 200 kW and 225 l/min in a compact design
  • OCP-compatible design: Designed for integration into OCP Open Rack v3
  • Maximum availability: Redundant pumps and defined fallback scenarios ensure continuous operation
  • Easy maintenance during operation: Hot-swappable sensors and controllers, as well as an externally accessible filter, reduce downtime
  • Seamless integration into monitoring systems thanks to a wide range of network protocols

RearDoor HEx

Rear Door Heat Exchanger

  • High performance in a compact design: 80 kW at 13,500 m³/h and 260 mm depth
  • Flexible applications: for air-cooled IT hardware or in combination with DLC for efficient removal of residual waste heat
  • Seamless integration into OCP Open Rack v3
  • Maximum availability: Redundant fans and defined fallback scenarios ensure continuous operation
  • Easy maintenance during operation: Hot-swappable components such as fans, sensors, displays, and controllers reduce downtime. A separate service door allows for quick and easy access.

Manifolds

Rack Manifolds for Open Rack v3

  • Custom-designed manifold rails for safe and efficient distribution of coolant
  • Flexible configuration: Customizable drip-free quick-disconnect couplings (UQDB), variable connection positions, and optional integration of liquid-cooled busbars and temperature and pressure sensors

Benefits for Operation, Integration, and Growth

With Direct Liquid Cooling from Rittal, you benefit from solutions that go far beyond pure cooling performance. A well-designed system architecture, OCP-based standards, and reliable supply chains ensure maximum availability for your AI and HPC applications.

Your trusted partner

With over 40 years of experience in the field of cooling, Rittal offers you high-quality products as well as reliable and scalable production capacities for your direct liquid cooling solution.

Direct Liquid Cooling in hyperscale data centres – Empowering AI

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We'll be delighted to answer all your questions relating to the Direct Liquid Cooling.

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OCP ORV3 rack

Take your rack density to a new level!

OCP is a community with a clear goal: To standardise and optimise IT infrastructure. Rittal has been actively involved in OCP projects for years. The result: A rack that is 100% OCP-compliant. For maximum future-proofing.