Direct Liquid Cooling (DLC)

AI 및 HPC 애플리케이션을 위한 강력한 모듈형 솔루션 포트폴리오

AI cooling

Direct Liquid Cooling

Artificial intelligence and high-performance computing (HPC) pose new challenges for data centers. Increasing computing power and high-power densities resulting from AI workloads, GPUs and processors generate massive heat loads of over 150 kW per rack. These can no longer be efficiently managed with conventional air cooling alone. At the same time, demands for energy efficiency, availability and scalability of systems are growing across all industries, applications and data center sizes. New cooling concepts are therefore no longer an option, but a must.

Direct Liquid Cooling opens up new possibilities for cooling AI and HPC infrastructures. By efficiently dissipating heat via liquid, maximum cooling performance is delivered exactly where it is needed.
This technology lays the foundation for modern AI environments – from individual racks to scalable data center designs.
 

Rittal Product Portfolio for Direct Liquid Cooling

CDU In-Row

Liquid-to-liquid Coolant Distribution Unit In-Row 

  • Enormous performance in a small footprint, OCP-compliant: Up to 1.5 MW and 1,500 l/min in the OCP Open Rack v3
  • Flexible scaling: Modular design for on-demand expansion – “pay as you grow”
  • Maximum availability: Redundant components and defined fallback scenarios ensure continuous operation
  • Easy maintenance during operation: Hot-swappable components, such as pumps, filters, sensors, and controllers, reduce downtime
  • Seamless integration into monitoring systems thanks to a wide range of network protocols

CDU In-Rack

Liquid-to-liquid Coolant Distribution Unit In-Rack 21"

  • High performance: Up to 200 kW and 225 l/min in a compact design
  • OCP-compatible design: Designed for integration into OCP Open Rack v3
  • Maximum availability: Redundant pumps and defined fallback scenarios ensure continuous operation
  • Easy maintenance during operation: Hot-swappable sensors and controllers, as well as an externally accessible filter, reduce downtime
  • Seamless integration into monitoring systems thanks to a wide range of network protocols

RearDoor HEx

Rear Door Heat Exchanger

  • High performance in a compact design: 80 kW at 13,500 m³/h and 260 mm depth
  • Flexible applications: for air-cooled IT hardware or in combination with DLC for efficient removal of residual waste heat
  • Seamless integration into OCP Open Rack v3
  • Maximum availability: Redundant fans and defined fallback scenarios ensure continuous operation
  • Easy maintenance during operation: Hot-swappable components such as fans, sensors, displays, and controllers reduce downtime. A separate service door allows for quick and easy access.

Benefits for Operation, Integration, and Growth

With Direct Liquid Cooling from Rittal, you benefit from solutions that go far beyond pure cooling performance. A well-designed system architecture, OCP-based standards, and reliable supply chains ensure maximum availability for your AI and HPC applications.

Direct Liquid Cooling in hyperscale data centres – Empowering AI

Contact

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Discover our IT cooling solutions

OCP is a community with a clear goal: To standardise and optimise IT infrastructure. Rittal has been actively involved in OCP projects for years. The result: A rack that is 100% OCP-compliant. For maximum future-proofing.

IT 인프라

IT 냉각

리탈의 공조 컨셉트는 단일 랙의 냉각부터 전체 데이터 센터에 이르기까지 모든 적용 분야를 포괄함. 안전과 효율성에 중점을 둠.

OCP ORV3 랙

랙 밀도를 새로운 차원으로 끌어올리세요!

OCP는 IT 인프라를 표준화하고 최적화한다는 명확한 목표를 가진 커뮤니티입니다. 리탈은 수년 동안 OCP 프로젝트에 적극적으로 참여해 왔습니다. 그 결과, 100% OCP 규격을 준수하는 랙이 탄생했습니다. 미래의 변화에도 완벽하게 대비할 수 있도록 설계되었습니다.

신뢰할 수 있는 파트너

40년 이상의 냉각 분야 경험을 보유한 리탈은 고품질 제품은 물론 안정적이고 확장 가능한 생산 능력을 통해 고객의 직접 액체 냉각 솔루션을 지원합니다.